Investigation of the reliability for the Flip-Chip Package
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 98 === Abstract In this study, the finite element analysis using the commercial code ANSYS12.0 has been performed to study the thermal-mechanical and heat-transfer behavior in the FC-PBGA. FC-PBGA model consists of seven parts, including heat spreader, molding compou...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81753194367549513650 |