Analysis of Bimaterial Interface Crack Growth Using Cohesive Zone Model
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 98 === From the perspectives of capabilities and manufacturing costs, a lot of structures and assembled using distinct materials. Under either thermal or mechanical stresses during fabrication or in-use conditions, debonding is likely to occur on the interface of m...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/44668705087017044876 |