Channel Cracking and Interfacial Delamination Analyses for Thin Film and Interconnect Structures Applications
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 98 === Microsystem devices are composed of multi-layered thin films with different material properties and structural thickness, and are connected with each other via metallic interconnect structures. However, during fabrication, the therm-mechanical mismatch between...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/78288771768886357278 |