Effect of Lanthanum Addition on the Microstructure Evolution and Adhesive Strength of Sn-Ag-Sb Lead-Free Solder Joints
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 98 === The effects of adding 0 ~ 0.5 wt.% La into Sn-3Ag-2Sb-xLa/Cu lead-free solder joints on microstructure, microhardness, adhesive strength, as well as the interfacial IMC (Intermetallic Compound) layers were studied in this research. The influences of different...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67872517049187510136 |