Effect of Pt Addition on Tensile Strength of Reflowed Cu/SAC305/Cu Joints
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 98 === Solder joints may be damaged by external force during using of electronic packaged products, so the mechanical strength of joints between the solder and the substrate is important to the reliability of electronic package. The aim of the study is to explore...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10013230472147214017 |