The Interfacial Reaction between Liquid Sn-Ag Solder and Electroless Nickel-Phosphorous Deposit
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 98 === This research investigated the interfacial reaction between liquid Sn-3Ag solder and electroless nickel with 7 wt.% phosphorous. The wettability between Sn-Ag solder and electroless nickel was investigated with wetting balance. After the wettability test,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/92987538844660830797 |