Interval Optimization of Fatigue Life for Stacked Die Quad Flat No Lead Package by Interval Genetic Algorithm

碩士 === 國立成功大學 === 工程科學系碩博士班 === 98 === With the characteristics of miniature in size, good electric and thermal performance, low manufacture costs as well as low failure rate, the QFN has been paid attention gradually in the market. The stacked die QFN package is adopted to analyze the effects of th...

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Bibliographic Details
Main Authors: Sheng-MuLo, 羅盛沐
Other Authors: Rung-Sheng Chen
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/58153899395742450062