A Study of Fine Copper Wire for SOC Packaging
碩士 === 明新科技大學 === 系統晶片與嵌入式系統產業研發研究所 === 98 === With the progress of science and technology industry, not off, consumer demands for electronic products, in order to meet consumer demand, IC design companies to develop a variety of products to meet market trends, multi-system towards integrated ch...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82442100182110512136 |