| Summary: | 碩士 === 明新科技大學 === 光電科技產業研發碩士專班 === 98 === The performance of an optical coating for most applications depends on its thickness. A good uniform distribution of film thickness is necessary for coatings over the areas of the substrate holders or substrates of a thermal evaporation PVD unit. It represents a large extent and much capacity of a coating production, and a low production cost. The method of a mask is often used to obtain a good uniformity of film thickness. The mask, situated between the source and the substrate inside the coaters, can correct a thickness distribution of thin films.
In this study, a mask in thickness uniformity is fully studied with the assumption that atoms and molecules emitted by the source travel in straight lines to the substrates, which rotate about the central axis during films deposition. The film thickness distribution in the mask put on three different positions is discussed inside an electron-beam gun coater. The emissive characteristic of the source with aluminum films in this study is 3.4, obtained by the least square method. This study also shows the best coating parameters and a mask in a 600 mm-box coater, which can reduce a loss to coating material and manufacture time in a mass production of thin films.
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