Analysis Study on the High Power LED Thermal Cooling Technology and Thermal Stress of Packaging
碩士 === 明新科技大學 === 精密機電工程研究所 === 99 === Currently, in order to increase the brightness of the Light emitting diode, almost the LED has been designed to augment the input power which makes the chip overheat and junction temperature rise occurred frequently in LED chip problem. This thesis is focused...
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| Format: | Others |
| Language: | zh-TW |
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2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94869193907646750641 |