Study of Delamination for Die Attach Process in IC Assembly
碩士 === 明新科技大學 === 精密機電工程研究所 === 99 === The application of Die Attach Film (DAF) has greatly improved the quality for IC assembly. It is also a cost effective technology getting more and more interesting in industry. Warpage, delamination and cracking are problems common found during IC assembly....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69531591899062063764 |