The Study on Improvement of Epoxy Molding Efficiency Through Minimizing Adhesion Effects IC Epoxy Molding Process

• Main Author: 洪東光
• Other Authors: 翁琳松
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/53387614100306914796

碩士 === 明新科技大學 === 系統晶片與嵌入式系統產業研發研究所 === 98 === Abstract Adhesion Effects, which relates to adhesion between EMC (Epoxy Molding Compound) and IC mold surface in curing, occur in IC package. The effects not only lead to mold adhesion in ejection, but also influence quality of products, damage products, fail to molding, and cause the reduction of the yield rate. And how to minimize the influence of adhesion effects through adequate surface treatments and coating without mold design change is an urgent issue for the industry and researchers. Based on adhesion as parameters, this study applies adhesion force technique and shear adhesion force to five coating to find out effective coating and adhesion force. With the examination of repeatability and accuracy of the result, the understanding of adhesion force can indicate the time to cleaning molds, shorten the cleaning times and the time, and increase efficiency to reduce bad effects. Keywords：IC Package, Epoxy Molding Compound, Adhesion Effect, Mold Surface Coating