The Study on Improvement of Epoxy Molding Efficiency Through Minimizing Adhesion Effects IC Epoxy Molding Process
碩士 === 明新科技大學 === 系統晶片與嵌入式系統產業研發研究所 === 98 === Abstract Adhesion Effects, which relates to adhesion between EMC (Epoxy Molding Compound) and IC mold surface in curing, occur in IC package. The effects not only lead to mold adhesion in ejection, but also influence quality of products, damage produc...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53387614100306914796 |