Micro Punching Process Improvementby Using Cushion Pad

• Main Authors: Chi-Chun Huang, 黃啟純
• Other Authors: Da-Chen Pang
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/00673355513792559214

碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 98 === Abstract This research investigates the effect of cushion pad on punching process to further reduce the size of micro tag. Previous study has found that the punching load is too large and even causes the buckling of the cutting blade. By adding a cushion pad under the PET film for the tag this fabrication process will decrease the punching load and improve the quality of the micro tag. The micro punch for this study has a multiple parallel blade design. The blades have 180o flat-type and 70o angular-type two tip shapes. The micro punches are made using anisotropic silicon etching and LIGA-like techniques. The KMPR 1050 photoresist is chosen to achieve high aspect ratio structure and good stripability after Ni-Co electroforming. The smallest flat-type blade has a width of 5 μm, depth of 23 μm, and pitch of 30 μm. The smallest angular-type blade has a width of 8μm, depth of 30 μm, and pitch of 48 μm. The overall size of the mold is 5mm × 5mm. The finite element software DEFORM 2D is utilized to predict the required load for micro punching process with cushion pad. The study also investigates other factors such as blade tips, blade width, and PET film thickness. Both theoretical and experimental results show that the punching loads are effectively reduced by using cushion pad. The punching loads for flat-type blades drop more than 40% and there is no bulking even for blade width of 5 μm. This research demonstrates the effect of cushion pad on reduction of punching load and fabrication of 25 μm ×25 μm micro plastic tags. A higher quality of sheared edge and a lower load can be achieved by using the flat-type blades with cushion pad.