Micro Punching Process Improvementby Using Cushion Pad
碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 98 === Abstract This research investigates the effect of cushion pad on punching process to further reduce the size of micro tag. Previous study has found that the punching load is too large and even causes the buckling of the cutting blade. By adding a cushion...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00673355513792559214 |