A Study of Novel Wafer Level MEMS Package Method

• Main Authors: Yi Ling Cheng, 鄭尹琳
• Other Authors: Lin Hong
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/67242286074208806236

碩士 === 國立高雄應用科技大學 === 電機工程系 === 98 === This study aims to improve single-die packaging used in IC packaging technology. In the past, singe-die packaging couldn’t satisfy requirements of MEMS, like micro sensors or micro actuator such as miniature accelerometer, micro-optical scanning mirror, micro oscillator or RF MEMS switch etc, all of whose internal moveable micro device typically require vacuum environment in order to raise quality factor (Q) and then enhance operation effectiveness. Especially in consideration of reducing packaging cost and increasing production yield, the wafer level vacuum packaging technology possessing small size and high density has gradually become the mainstream of MEMS packaging development. If previous single-die packaging was adopted, the production cost couldn’t be reduced in terms of characteristic of batch production. The focus of this thesis is to improve the current WLP vacuum packaging used industry by using simple and easy printing technology on glass encapsulation with vacuum sealing joints, a newly developed MEMS WLP system. The main production is comprised of packaging structuring process, bonding process, and dicing process. With the simple MEMS device made by Bulk Micromachining as substrate, low refractive index glass as packaging cover and special polymer material-glass paste as a bonding material, the WLP vacuum packaging can be encapsulated by aligning above-mentioned substrate and cover under vacuum, proper pressure and appropriative temperature. Meanwhile, since glass paste has robust bonding strength with glass and silicon, the influence of thermal expansion can be extensively reduced. In addition, this method can also be applied for the packaging of those micro optical devices which required transparent effect, because this technology adopts glass substrate encapsulation Key words: MEMS, wafer-level, vacuum packaging, seal test