A Study of Novel Wafer Level MEMS Package Method
碩士 === 國立高雄應用科技大學 === 電機工程系 === 98 === This study aims to improve single-die packaging used in IC packaging technology. In the past, singe-die packaging couldn’t satisfy requirements of MEMS, like micro sensors or micro actuator such as miniature accelerometer, micro-optical scanning mirror, micro o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67242286074208806236 |