The Interfacial Reaction Investigation Between Sn-3.5Ag and Ni Substrate

• Main Authors: Ji-Jyun Yang, 楊吉駿
• Other Authors: Sheng-Rui Jian
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/45369287072958447229

碩士 === 義守大學 === 材料科學與工程學系碩士班 === 98 === In order to understand the mechanism of intermetallic compounds (IMCs) formation and growth between Sn3.5Ag solder and Fe-Co-Ni substrate and their effects with reliability, this study would experience multiple reflows and high temperature storage, to observe the growth of IMCs and the mechanism of voids growth, and further explorer the relationship among them. After Sn-3.5Ag solder and Fe-Co-Ni substrate bonding reaction, the Ni3Sn4 IMCs formed at the interface, and the Ni3Sn4 IMCs with a little Co elements of Ni solubility；and the solder in Co、Ni element diffusion into and the formation of (Ni, Co)Sn4, and Ag3Sn particles above the location of a reunion. Experience of 1000 hours aging, the solder observed (Ni, Co)Sn4 and (Ni, Co)Sn2 two phase；while experiencing 7 reflows test its IMC composition is irregular, but close to being rich Sn phase. High temperature storge tests on IMCs layer thickness measurement, the growth rate of Sn3.5Ag/Fe-Co-Ni is much faster than Sn3.5Ag/Ni and Sn3.5Ag/Co. And using XRD analysis of detecting IMCs and decides the IMCs is Ni3Sn4 which the results correspond WDS analysis. And observe the formation of voids and to explorer the reason for its formation, that is attributed the Sn rapid consumed to form IMCs with Ni substrate, and its location is too late to be filled by other atoms and makes voids formation.