The Interfacial Reaction Investigation Between Sn-3.5Ag and Ni Substrate
碩士 === 義守大學 === 材料科學與工程學系碩士班 === 98 === In order to understand the mechanism of intermetallic compounds (IMCs) formation and growth between Sn3.5Ag solder and Fe-Co-Ni substrate and their effects with reliability, this study would experience multiple reflows and high temperature storage, to observe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45369287072958447229 |