Improving Semiconductor Packing Process Quality by Applying SPC Control Process

碩士 === 大葉大學 === 工學院碩士在職專班 === 98 === Statistical process control technology for the industrial sector had a considerable history, it is a good tool for improved process capability and quality control, this study uses the semiconductor IC packaging forming process to introduced into SPC system.Use th...

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Bibliographic Details
Main Authors: Po-Shin Tsai, 蔡泊欣
Other Authors: Feng Min Lai
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/44929543783351128071