A Study for Bonding Process and thermal-Moist-Mechanical Behaviors of Anisotropic Conductive Film on the Outer Lead Bonding

• Main Authors: Shu-Hui Peng, 彭淑惠
• Other Authors: Wen-Ren Jong
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/19322977384400737000

博士 === 中原大學 === 機械工程研究所 === 98 === The advantages of anisotropic conductive film adhering to the electronic component include the process easily, more mounting counts, and fine pitch’s high density packages so that it is wildly applied to the liquid crystal display. However, the manufacturing process of conventional-type ACF requires more pressure, higher temperature and longer time to melt the resin matrixes. This study investigates the new-type ACF which offers the lower bonding temperature and the reduced curing time. The experiment and finite element software (ANSYS) are used to understand the characteristics of the new-type ACF on the thermal, mechanical, electrical and adhesive behaviors within the criteria of the bonding specification. Also, the reliability of the new-type ACF is investigated under the thermal cyclic loading, peel test and moist test respectively. The results of curing degree, flow, contact resistance, adhesive strength and both deformed and trapped of conductive particles are properly for its application under the short reacting time. The resin matrixes has a little bit swelling behavior but it is not enough to break apart from all the components. Under Taguchi method, the inner conductive particle is subjected and deformed by both the external loading force and the extended force from the resin matrixes, and the bonding pressure is the most significant parameter. The delamination occurs at the interface between the resin matrixes and the glass substrate under the peel loading and then grows along the indium tin oxide. Also, the resin matrixes is easily affected by the temperature and moisture to damage the other components. Finally, this new-type ACF is applied to the drive chip and it is found that both bump height and resin matrixes thickness can be useful to improve the phenomenon of the stress concentration under the thermal cyclic loading.