A Study for Bonding Process and thermal-Moist-Mechanical Behaviors of Anisotropic Conductive Film on the Outer Lead Bonding
博士 === 中原大學 === 機械工程研究所 === 98 === The advantages of anisotropic conductive film adhering to the electronic component include the process easily, more mounting counts, and fine pitch’s high density packages so that it is wildly applied to the liquid crystal display. However, the manufacturing proce...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/19322977384400737000 |