Performance of High Power LED Thermal Dissipation

碩士 === 中華大學 === 機械工程學系碩士班 === 98 === The purpose of this study is to remove the 90μm thickness of sapphire substrate of LED and the epitaxial layer (EPI) still maintains its integrity. The epitaxial layer of LED was then put directly on diamond and silicon dissipation plate. The thermal performance...

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Bibliographic Details
Main Authors: Chin-Ming Wu, 吳智敏
Other Authors: Yu-Li Lin
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/53144410513704616153