Mechanical Properties of Sn-Ag-Cu-In-Zn-Bi Lead-free Solders at Ambient and Elevated Temperatures

• Main Authors: Kuo,Yu-hung, 郭育宏
• Other Authors: M.S. YEA
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/43808714409924068210

碩士 === 中華大學 === 機械工程學系碩士班 === 98 === The mechanical properties of a series of Sn-Ag-Cu-In-Zn-Bi solder alloys have been reported by tensile testing at strain rates of and at ambient and elevated temperatures. In this study, the Sn-3Ag-0.5Cu-2In-1Zn-1.5Bi solder potential lead-free solder, which possessed a solidus and liquidus between 201.25℃ and 233.75℃.The maximum tensile strength (UTS) and elongation were 19.98 MPa and 15.2％ at a strain rate of at room temperature. Moreover the UTS of this alloy decreased, but its elongation increased, with increasing testing temperature. During the fracture process, many small internal voids nucleated along grain boundaries, which reduced the solder’s cross-sectional area and led the Sn-3Ag-0.5Cu-2In-1Zn-1.5Bi solder fracture.