Mechanical Properties of Sn-Ag-Cu-In-Zn-Bi Lead-free Solders at Ambient and Elevated Temperatures
碩士 === 中華大學 === 機械工程學系碩士班 === 98 === The mechanical properties of a series of Sn-Ag-Cu-In-Zn-Bi solder alloys have been reported by tensile testing at strain rates of and at ambient and elevated temperatures. In this study, the Sn-3Ag-0.5Cu-2In-1Zn-1.5Bi solder potential lead-free solder, which...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43808714409924068210 |