Numerical Simulation of Boiling Process and Application on Thermal Bubble Inkjet
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 97 === With technology changing at such a rapid pace of modern micro-electronic components and the trend of chip-intensive and more rapid speed of operation with, more power required, it result in producing a more substantial amount of heat. In order to solve problem...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77759424148336890212 |