A study of thermal enhancement of micro-undulation-type fins

• Main Authors: Wen-Hon Chen, 陳文宏
• Other Authors: Feng-Tasi Weng
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/9gqpwh

碩士 === 國立虎尾科技大學 === 機械與機電工程研究所 === 97 === Owing to the central processing unit (CPU) Will produce great heat in high-speed computation, damaged CPU caused by heat accumulation and increased high temperature easily happened. A heat dissipation device was configured on a CPU to distribute from increasing hot with a fan, and is utilized commonly nowadays. Heat dissipation efficiency is highly influenced with the design of radiator. The purpose of this research is to study the performance of micro-undulation-type radiator based on the reasonable assumption. A software of finite element named ANSYS Multiphysics v11.0 is used to solve computation fluid dynamics (CFD). Heat transformation properties of micro-undulation-type radiator is analyzed. Temperature profile between solid and fluid is defined. Temperature gradation is figured by different meshing technique. Optimization of the radiator can be obtained base on the performance of radiator analyse.