A study of thermal enhancement of micro-undulation-type fins
碩士 === 國立虎尾科技大學 === 機械與機電工程研究所 === 97 === Owing to the central processing unit (CPU) Will produce great heat in high-speed computation, damaged CPU caused by heat accumulation and increased high temperature easily happened. A heat dissipation device was configured on a CPU to distribute from increas...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/9gqpwh |