The Influence of the Die Size on Delamination for Quad Flat Package

• Main Authors: Wen-Shang Chang, 張文尚
• Other Authors: Hsin-Hui Kuo
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/2u7dwz

碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 97 === This thesis focuses on the influence of the die size on the surface delamination for quad flat package（QFP）. The different die sizes would change the IC structure and led to different thermal stresses during Surface Mount Technology（SMT）process. Based on the results of the thermal stress simulation by different die sizes, for QFP 28×28 mm2 size, the obvious package warpage was observed when the die size was larger than 8500×8500μm2. Due to higher thermal stresses on the die surface, the delamination occurred around the die corners. From the results of the experiments, no die surface delamination was observed for the small die size. Implementing the pre-wire bond plasma clean process could make the die surface become rougher and cleaner. It would have the better adhesion with the mold compound and prevent the delamination.