The Influence of the Die Size on Delamination for Quad Flat Package
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 97 === This thesis focuses on the influence of the die size on the surface delamination for quad flat package（QFP）. The different die sizes would change the IC structure and led to different thermal stresses during Surface Mount Technology（SMT）process. Ba...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/2u7dwz |