Studies of Flip Chip Packages and Interfacial Reactions under Extra-high Current Density Tests with Low-temperature Control
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 97 === The miniaturization of electronic devices always accompanies the rise of interconnect current density, which makes the subsequent electromigration phenomenon cannot be ignored. Flip chip technology has now been widely used in packaging industry; because of it...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34915451993915112394 |