Resistivity Scaling in nano-scale Cu Thin Films
碩士 === 國立臺灣大學 === 光電工程學研究所 === 97 === Abstract As the scale of Cu interconnects reduces to sub-100nm, the drastic resistivity increases result from the decrease of Cu thickness, which is called “size effect”. This thesis focuses on the two major factors of “size effect”－ surface scattering and gra...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59870847611476958164 |