Metallurgical and substrate effects on the drop test reliability of BGA Pb-free solder joints
碩士 === 國立東華大學 === 材料科學與工程學系 === 97 === With respect to portable electronics which may experience accidental shock loadings subject to drop impact, fracturing of solder joints generally occurs at brittle IMCs at the interface, instead of solder bulk. In this study, the effects of solder composition...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77385994910857471614 |