Development of hot-melt adhesive pad and study of silicon wafer grinding effect
碩士 === 國立中央大學 === 機械工程研究所 === 97 === During the silicon wafer manufacture procedure , after slicing and edge contouring , silicon wafer surface results in saw mark and damaged layer and affects the following manufacture procedure . This research tries to combine new hot-melt adhesive pad with free S...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/08705599403038793060 |