Grain Rotation Induced by Electromigration in Pure Tin Strip
博士 === 國立中央大學 === 化學工程與材料工程研究所 === 97 === Electromigration is a generic reliability issue in electronic device and flip chip. Because the tin metal is the common material of solder, we study the effect of tin strip under electromigration. When high current density induced electromigration effect, th...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/ax5dg9 |