Study of the silicon wafer hump effects induced by pulsed laser texturing method

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === The surface hump of the silicon wafer induced by surface tension in pulsed laser texturing method has been investigated numerically and experimentally in this study. In the numerical simulation, the silicon substrate was treated as fluid flow and heated in la...

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Bibliographic Details
Main Authors: Bo-Sian Wu, 吳柏賢
Other Authors: Jehnming Lin
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/17442316911056193204