The Simulation of Reflow Process-Induced Residual Stress of micro-BGA Package
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of BGA package by applying finite element analysis of the commercial software ANSYS 11.0. BGA package model consists of five parts, they are so...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45420461270131736064 |