The Effects of Grinding Conditions on Parallelism of Thin Workpieces

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === Workpieces after grinding process might bend or deflect due to thermal deformation and induced residual stress after grinding process, especially for slender workpiece with low thickness-to-length ratios. In this paper, the bending extent of thin workpieces is...

Full description

Bibliographic Details
Main Authors: Yi-chung Chen, 陳以中
Other Authors: Jiunn-jyh Wang
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/08300189364294697982