Enhancing Remove Rate and Uniformity of The Deep Submicron CMOS Copper CMP Technology with Optimizing Soft Landing Polish System
碩士 === 國立成功大學 === 電機工程學系碩博士班 === 97 === In this thesis, we focused on the optimization of the soft landing polish step in a Cu chemical mechanical planarization (Cu CMP) process. With the optimized soft landing polish, one can achieve a better uniformity and less Cu residue, dishing, erosion, etc. C...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62468423307508446844 |