The Study of E-beam Inspection Application for Nano CMOS Technology Process Development and Excursion Monitor
碩士 === 國立成功大學 === 電機工程學系專班 === 97 === The IC process shrink into deep sub-micron regime, metal film changes from Al to Cu process. The Cu film can’t etch by physical or chemical process to form gas or liquid phase and exhaust from reaction chamber. There are many new issues happen in Cu damascene pr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55881957911311379877 |