Investigation and fabrication of electroplating Au for bump-pad and die-bond on light emitting diodes
碩士 === 國立成功大學 === 微電子工程研究所碩博士班 === 97 === With the development of solid-state lighting, the chief bottlenecks of traditional incandescent lamps replaced with light emitting diodes (LEDs) were problem of cost down and effective heat dissipation management. In this paper, our group developed the elect...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2009
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/07001378018967062805 |