Analysis of the Filling Flow of Underfill Encapsulation in Flip Chip Package
碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 97 === Abstract Along with advance in technology, Flip Chip has the tendence toward lower profile, lighter weight, and higher density. Due to the mismatch of the coefficients of thermal expansion (CTE) between the chip and substrate, the solder joints tend to fail...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96586560650421177918 |