The Dynamic Impact Behavior of Lead-free solders at elevated temperature

碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 97 === The mechanical properties of Sn63Pb37, SAC105 and SAC305 solders have been measured at high strain rates (1,000 ~ 3,000 s-1) using SHPB (split Hopkinson pressure bar) apparatus. Specimens were produced by quenching in air from the melt. Measurements were mad...

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Bibliographic Details
Main Authors: Ren-jie Lin, 林仁傑
Other Authors: Syh-Tsang Jeng
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/46630044667376807864