Electromigration in Eutectic Sn-9Zn Lead-Free Solder Joints

博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 97 === The purpose of this research is to investigate the electromigration (EM) behavior of metallic atoms in Sn-9Zn alloy. It also investigated the effect of electromigration on the interfacial reaction, the microstructural evolution of Sn-rich phase and Zn-rich...

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Bibliographic Details
Main Authors: Shih-Ming Kuo, 郭世明
Other Authors: Kwang-Lung Lin
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/75342160294958890522