Studies on the Adhesive Strength and Failure Behaviors of Solid-state Bonded SAC305/Cu Joint and its Statistical Analysis
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 97 === The formation of intermetallic compounds (IMCs) helps to provide good metallurgical bonding between solders and substrate in the microelectronic packing applications. Previous reports pointed out that the tensile stress is a main cause induces the fracture...
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| Format: | Others |
| Language: | zh-TW |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38387747969398857285 |