A Study on The Tensile Fracture Characteristics of EFO and Wire Bonded 15μm Grade Copper Wire
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 97 === Copper wire is getting well accepted as a reliable design alternative to the gold wire in the wire bonding process. In this study, 15μm copper wires are bonded to substrates by thermosonic process, and the tensile fracture characteristics of FAB samples and...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72120398004231414258 |