Planning of Post-Mold Curing Operation in IC Packaging
碩士 === 國立成功大學 === 工業與資訊管理學系碩博士班 === 97 === The post-mold cure operation is the back-end process of integrated circuit packaging in semiconductor industry. It involves baking the encapsulated IC in an oven for about 6-24 hours and at constant temperature. The main function of the baking is curing the...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95554094706324764606 |