A Study of Mechanical Stress from Packaging Trim and Form Process for the Whisker Formation
碩士 === 國立中興大學 === 資訊科學與工程學系所 === 97 === In tradition, SnPb was implementing on soldering material, not only to downgrade the melt temperature of solder, but also to restrain the Sn whisker as bridge to avoid circuit shorting on equipment .Lead- free solders can be used to replacing SnPb solders grad...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/30069473691934558135 |