Thermal Analysis of High Power LEDs with Advanced Package

碩士 === 高苑科技大學 === 電子工程研究所 === 97 === Abstract A serial simulation and analysis of the temperature distribution of the high power LEDs with IMS and MCPCB package at three different powers by using FEMLAB has been carried out in this study. It also explores the improvement in heat transfer of the mode...

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Bibliographic Details
Main Authors: Bon-Chen Kuo, 郭邦彰
Other Authors: Chin-Chuan Hsu
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/44067227464794427818