Study of Inter-metallic compound crack during BGA packaging process
碩士 === 國立高雄應用科技大學 === 電機工程系 === 97 === For wire bond in the semiconductor assembly process, the good and tight Inter-metallic Compound (IMC) is the key factor to get well adhesion between Au-Al. This kind of structure is a hard and electric conduction between silicon in side and outside from the die...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59146079887787375909 |